AP 4037 is a special dry acid mixture where specially developed for surface activation of Copper and Copper Alloy.

AP 4037 provides perfect surface adhesion to subsequent coating by means of microetching effect at the surface of Copper and Brass. Through this property, is gained wide usage area after Cyanide Copper and Acidic Copper Plating.

AP 4037 also cleans the light Brown oxide layer developed at surface of Copper and Brass after electrolytic decreasing and restores real color of the product and it provides excellent adhesion to the subsewuent plating layer.